EE2033 MICRO ELECTRO MECHANICAL SYSTEMS Syllabus | EEE |Anna University | Regulation 2008 | (Applicable to the students admitted from the Academic year 2008 – 2009 onwards)


EE2033 MICRO ELECTRO MECHANICAL SYSTEMS L T P C
3 0 0 3
AIM
The aim of this course is to educate the student to understand the fundamentals of Micro Electro
Mechanical Systems (MEMS)
OBJECTIVES
At the end of this course the student will be able to
(i) integrate the knowledge of semiconductors and solid mechanics to fabricate MEMS devices.
(ii) understand the rudiments of Microfabrication techniques.
(iii) identify and understand the various sensors and actutators
(iv) different materials used for MEMS
(v) applications of MEMS to disciplines beyond Electrical and Mechanical engineering.
UNIT I INTRODUCTION 9
Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and Actuators –
Introduction to Microfabrication - Silicon based MEMS processes – New Materials – Review of
Electrical and Mechanical concepts in MEMS – Semiconductor devices – Stress and strain analysis
– Flexural beam bending- Torsional deflection.
UNIT II SENSORS AND ACTUATORS-I 9
Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger capacitor –
Comb drive devices – Thermal Sensing and Actuation – Thermal expansion – Thermal couples –
Thermal resistors – Applications – Magnetic Actuators – Micromagnetic components – Case studies
of MEMS in magnetic actuators.
UNIT III SENSORS AND ACTUATORS-II 9
Piezoresistive sensors – Piezoresistive sensor materials - Stress analysis of mechanical elements –
Applications to Inertia, Pressure, Tactile and Flow sensors – Piezoelectric sensors and actuators –
piezoelectric effects – piezoelectric materials – Applications to Inertia , Acoustic, Tactile and Flow
sensors.
UNIT IV MICROMACHINING 9
Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma Etching –
Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase Etchants – Case studies -
Basic surface micromachining processes – Structural and Sacrificial Materials – Acceleration of
sacrificial Etch – Striction and Antistriction methods – Assembly of 3D MEMS – Foundry process.
UNIT V POLYMER AND OPTICAL MEMS 9
Polymers in MEMS– Polimide - SU-8 - Liquid Crystal Polymer (LCP) – PDMS – PMMA – Parylene –
Fluorocarbon - Application to Acceleration, Pressure, Flow and Tactile sensors- Optical MEMS –
Lenses and Mirrors – Actuators for Active Optical MEMS.
TOTAL : 45 PERIODS
107
TEXT BOOK:
1. Chang Liu, ‘Foundations of MEMS’, Pearson Education Inc., 2006.
REFERENCES:
1. Nadim Maluf, “ An introduction to Micro electro mechanical system design”, Artech
House, 2000.
2. Mohamed Gad-el-Hak, editor, “ The MEMS Handbook”, CRC press Baco Raton, 2000
3. Tai Ran Hsu, “MEMS & Micro systems Design and Manufacture” Tata McGraw Hill,
New Delhi, 2002.
4. Julian w. Gardner, Vijay k. varadan, Osama O.Awadelkarim,micro sensors mems and
smart devices, John Wiley & son LTD,2002
5. James J.Allen, micro electro mechanical system design, CRC Press published in 2005









By Vinoth
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